Tag Archives: Wafer Testing

Expanding Device Characterization Performance and Productivity

Our Infinity Probe® sets a standard of performance by ensuring better measurements on aluminum pads, reducing reprobing and errors in measured data. We believe it’s a key component of an int… [View More]

Factors Impacting Wafer-Level Test Productivity

In general, analytical probers used in test labs or fabless facilities are not equipped with automatic Probe-to-Pad Alignment (PTPA) technologies. PTPA errors must be corrected manually, adding unnece… [View More]

Wafer-Level LED Test: CoO and Performance Roadmap

Recently our own Bryan Bolt presented at SEMICON West on the growing importance that LED device manufacturers are placing on cost reduction – with emphasis on wafer level LED test. The presentat… [View More]

Electrical Performance Effects on Wafer Level Test

Our own Mike Fredd recently gave a presentation on the electrical performance effects on wafer level test entitled The Electromechanical Design of Spring Pin Based WLCSP Contact Engine and Its Effect … [View More]

Unattended Wafer Testing Over Multiple Temperatures

The demands to reduce time-to-market, shrink device geometry, and increase reliability are relentless in the semi-conductor development environment. That is why it is becoming even more critical to in… [View More]