Tag Archives: RF Probes

Challenges with Aluminum Pad Probing

Devices with aluminum pads are much more difficult to probe than devices with gold pads, which are typically on III-V semiconductors. The productivity of characterization engineers is sig­nificant… [View More]

Application of a Two-Tier Vector Network Analyzer RF Calibration

Two-tier RF calibration of a Vector Network Analyzer (VNA) using WinCal XE™ is a technique that allows two RF calibration error sets to be combined into one resulting error set for the VNA error… [View More]

Highly Accurate Characterization of RF Power Devices at Wafer Level

The proliferation of smartphone technology is creating a demand for wireless access to content from anywhere in the world. This, in turn, creates the need for RF power devices in new technologies such… [View More]

InfinityQuad™ Multi-Contact Probe a Finalist for Best in Test Award

We’re excited to announce that our new InfinityQuad multi-contact RF/mmW probe is a finalist in Test & Measurement World’s Best in Test awards for 2012. InfinityQuad probe ensures reli… [View More]

Hybrid Calibration for 4-Port On-Wafer Probing

System calibration is critical to getting accurate measurement data from RF wafer devices. During calibration, a set of known standards must be presented to the tip of the probe. This requires multipl… [View More]

New Device Design Guidelines for RF Probing

In order to achieve a good calibration and ensure high repeatability of subsequent measurements, pad placement on the device under test (DUT) must be considered. Many of these rules are directly appli… [View More]