Tag Archives: Probes

Challenges with Aluminum Pad Probing

Devices with aluminum pads are much more difficult to probe than devices with gold pads, which are typically on III-V semiconductors. The productivity of characterization engineers is sig­nificant… [View More]

Cascade Microtech Makes List of Top 10 Area Patent Holders

What a great way to end the year and usher in a new one! The Portland area list of the top 10 patent holders, with Silicon Forrest tech giants such as Sharp Laboratories, Intel and Xerox, now has some… [View More]

5 Probe Card Online Cleaning Mistakes to Avoid

Probe cards being used in production applications require periodic cleaning to remove particulate contamination that can build up on the probe face and tips. The usual symptom of particulate contamina… [View More]

Influence of Probe Tip Calibration on Measurement Accuracy

We’re excited to announce that on Tuesday October 11th, at the IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) we’ll be presenting on the topic – Influence of Probe Tip Ca… [View More]

Probe Card Cleaning 101

To protect your probe card investment, prevent probing errors and avoid device damage, we’ve outlined the following cleaning regimen for the off-line cleaning of your probe card. This process is… [View More]

Unattended Wafer Testing Over Multiple Temperatures

The demands to reduce time-to-market, shrink device geometry, and increase reliability are relentless in the semi-conductor development environment. That is why it is becoming even more critical to in… [View More]