Challenges with Aluminum Pad Probing
Devices with aluminum pads are much more difficult to probe than devices with gold pads, which are typically on III-V semiconductors. The productivity of characterization engineers is significant… [View More]
Devices with aluminum pads are much more difficult to probe than devices with gold pads, which are typically on III-V semiconductors. The productivity of characterization engineers is significant… [View More]
What a great way to end the year and usher in a new one! The Portland area list of the top 10 patent holders, with Silicon Forrest tech giants such as Sharp Laboratories, Intel and Xerox, now has some… [View More]
Probe cards being used in production applications require periodic cleaning to remove particulate contamination that can build up on the probe face and tips. The usual symptom of particulate contamina… [View More]
We’re excited to announce that on Tuesday October 11th, at the IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) we’ll be presenting on the topic – Influence of Probe Tip Ca… [View More]
To protect your probe card investment, prevent probing errors and avoid device damage, we’ve outlined the following cleaning regimen for the off-line cleaning of your probe card. This process is… [View More]
The demands to reduce time-to-market, shrink device geometry, and increase reliability are relentless in the semi-conductor development environment. That is why it is becoming even more critical to in… [View More]