Tag Archives: Probe Cards

Four-Step Process for Pyramid Probe Card Core Off-Line Cleaning

To protect your investment, prevent probing errors and avoid device damage, be sure to carefully follow the four-step cleaning process described here for the off-line cleaning of your Pyramid Probe ca… [View More]

Challenges with Wafer Probing on Fine-Pitch Micro-Bumps for 2.5D- and 3D-SICs

Recent advances in semiconductor processing technology enable the manufacturing of integrated circuits with Through-Silicon Vias (TSVs). TSV is a conducting “nail” that provides an electri… [View More]

Online Abrasive Cleaning Methods for Pyramid Probe Cards

The cleaning frequency and intensity needed to keep a Pyramid Probe® operating at its best are related to the probing environment itself. Therefore, the exact formula for cleaning Pyramid Probes m… [View More]

Viper™ Probe Cards are Here

Now available… the first in the series of Viper™ probe cards. Viper probe cards will be used for test of high-volume production wafer-level chip-scale packaged devices (WLCSP). In smart … [View More]

S-Technology™ Delivers Improved Contact Physics

S-Technology provides a unique mechanical architecture for our Pyramid Probe® cards which is designed to consistently deliver evenly distributed contact force for solder bump technologies, which a… [View More]

Cascade Microtech at SEMICON China March 15-17

At SEMICON China 2011, Cascade Microtech (Booth# 2416 with Alltek Company) will exhibit our various RF/Microwave probes, Pyramid Probe ® cards, ATE contactors and engineering test sockets. We also… [View More]