New Device Design Guidelines for RF Probing

Posted on April 29, 2011 by Cascade Microtech Posted in Probe Design
The following guidelines should be considered when designing a new device for RF probing.
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S-Technologyâ„¢ Delivers Improved Contact Physics

Posted on April 21, 2011 by Cascade Microtech
S-Technology™ Delivers Improved Contact Physics for Consistent Mechanical Force across Multi-Site Die, and provides unique architecture for Pyramid Probe® cards
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BlueRay DS Probe System Wins Compound Semiconductor Award

Posted on April 14, 2011 by Cascade Microtech
We're thrilled that our BlueRay™ DS Probe system won Compound Semiconductor magazine’s Metrology, Test and Measurement Award.
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Unattended Wafer Testing Over Multiple Temperatures

Posted on April 7, 2011 by Cascade Microtech
Keeping the thermal chuck on-site during the probe tip and wafer tracking mode, it does not induce any thermal imbalance to the prober, reduce or remove soak times.
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1/f noise measurement solutions with on-wafer RTS characterization capability

Posted on April 5, 2011 by Cascade Microtech
In April and May we will exhibit Edge™1/f noise measurement solutions and we will showcase Edge solution’s on-wafer RTS noise characterization capability.
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The Clear Advantages of a Double-Side Probe System

Posted on March 31, 2011 by Cascade Microtech
Before Cascade Microtech’s BlueRay™ double side probe systems, testing the top and bottom of the wafer could only be done in the packaged state.
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