Category Archives: Probe Systems

Achieving Accurate, Wafer-Level Power Device Characterization

Until recently, power device manufacturers have been saddled with the task of sending power devices out for packaging prior to characterization and model extraction. This extra step adds cost, plus de… [View More]

Cascade Microtech Makes List of Top 10 Area Patent Holders

What a great way to end the year and usher in a new one! The Portland area list of the top 10 patent holders, with Silicon Forrest tech giants such as Sharp Laboratories, Intel and Xerox, now has some… [View More]

How to connect WinCal XE 4.5 to a VNA with the new VISA option

With version 4.5, WinCal XE goes beyond GPIB and offers a new, more flexible form of communication with all Vector Network Analyzer (VNA) instruments that support it. For those VNAs WinCal XE offers n… [View More]

Addressing Challenges to 4-Port On-Wafer Probe Measurements

When moving from 2-port measurements to 4-port device measurements, the first thing you might ask is, “Can my 2-port methods be directly applied to 4-port?” The answer is clearly: NO. Seve… [View More]

Hybrid Calibration for 4-Port On-Wafer Probing

System calibration is critical to getting accurate measurement data from RF wafer devices. During calibration, a set of known standards must be presented to the tip of the probe. This requires multipl… [View More]

5 Unique Challenges with Achieving Accurate Power Device Characterization

Emerging energy standards are driving a clear and present demand for efficient power utilization. In turn, the impact on power semiconductor device manufacturers is growing, and with it the demand for… [View More]